News
BANNOCKBURN, IL – IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
BANNOCKBURN, IL – The first IPC standard that originated outside the US, IPC-7527, Requirements for Solder Paste Printing, is the first standard developed that focuses on the application of solder paste.
GAINESVILLE, GA – Count On Tools says it has expanded its manufacturing operations at its headquarters here.
LAGUNA, PHILIPPINES – Electronics manufacturing services firm Integrated Micro-Electronics Inc. reported a first-half 2012 net income increase of 173% to $3.1 million year-over-year.
ST. LOUIS – Viasystems Group reported second-quarter net sales of $296.9 million, up 9.6% year-over-year, and up 13.3% sequentially.
Press Releases
- Semi-Kinetics Expands Capabilities with Installation of Three Koh Young 3D Automated Optical Inspection Systems
- ZESTRON Hosts Webinar on Cleaning Strategies and Corrosion Mitigation to Advance Reliability in Automotive Power Electronics
- Anda Technologies Appoints Tech Gear Ltd. as Distributor in Hungary
- Discover PEMTRON’s Dual Lane Dual Head AOI/SPI Technology at NEPCON Vietnam 2024