News
PALO ALTO, CA -- Hewlett-Packard's commitment to its struggling PC business is drawing new attention thanks to its latest SEC filing that indicates certain units might be on the block.
HERNDON, VA -- A new International Electronics Manufacturing Initiative white paper sets forth ways to "simplify and align" the reams of environmental data mandated by various governments and the electronics supply chain.
CUPERTINO, CA -- The US Patent Technology Office has issued Apple a patent covering a systems and methods for providing a system-on-a-substrate.
PHOENIX, AZ -- Suntron has signed a definitive agreement to sell its Methuen, MA-based Embedded Computing Solutions business unit to Axiomtek USA, the North American subsidiary of Taiwan-based Axiomtek.
OYSTER BAY, NY -- Small cell equipment, including units designated for public venues like shopping malls, are expected to grow 67% compounded annually to $3.1 billion in 2018, new research indicates.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing