ARLINGTON, VA -- Jedec has published a new series of standards for component-level testing of high-brightness/power LEDs.

NEVADA CITY, CA – IC packaging revenue is expected to grow 9.8% compounded annually, versus a CAGR of 7.3% for unit shipments through 2016, says New Venture Research.

Handheld electronic gadgets such as smartphones and tablets are driving the demand for ICs in the consumer electronics industry, as is the return in demand for automobiles, the firm says.

Increased demand for product functionality is driving up the IC packaging revenue faster than IC unit growth. The growth in handheld gadgets, which are increasingly digital in design, will boost the growth of special purpose logic communications chips by a 16.7% CAGR for device revenue through 2016, versus a 13.5% CAGR in units. FBGA and QFN package solutions are the most in demand, which pull at either end of the pricing structure. QFPs are ranked third as a package solution, but are decreasing in demand over time. These devices are expected to have a 14.8% CAGR in revenue through 2016.

Wireless infrastructure products are also in high demand, which is helping boost consumption for standard cell and PLD chips, says NVR. These devices will grow at a CAGR of 16.1% in terms of revenue through 2016, while the device units are projected at 15%. High I/O BGAs are the package solution of choice over the forecast period, the firm notes, so the package revenue growth is projected to be slightly higher, at a CAGR of 16.3% through 2016.

Logic chips are in demand for a host of products; therefore, 32-bit MCUs are expected to have an 11.1% CAGR unit demand, although only a device revenue CAGR of 4.7% through 2016. QFPs and BGAs have the highest demand of the package solutions, although the QFP is waning in favor of the BGA. Thus, the package revenue is growing at a CAGR of 12.8% through 2016 for 32-bit MCUs, according to NVR.

BANNOCKBURN, IL – The updated IPC/JEDEC-9704A, Printed Circuit Assembly Strain Gage Test Guideline, makes it easier for engineers to run strain gage tests during the manufacturing process, says IPC.

“Revision A is about making sure there’s a common accepted practice for measuring manufacturing strain on printed board assemblies due to board flexure,” said Jagadeesh Radhakrishnan, a reliability engineer with Intel and leader of the effort within the IPC SMT Attachment Reliability Test Methods Task Group that helped revise the guideline. Whereas the first-generation document provided industry with target pass/fail points, the A revision, “… changes the focus to providing a methodology. It doesn’t give you targets; it thoroughly explains how to measure strain.”

Revision A includes formulas for calculating strain and describes techniques for analyzing data derived from these tests. The tests can be performed at many stages during the manufacturing of printed board assemblies. Components can be tested during assembly or during test processes in the factory or just before they’re packaged.

IPC/JEDEC-9704A also provides recommendations for sockets and ceramic capacitors; in the past, it just addressed ball grid arrays. “It also changes parameters for in-circuit test fixtures, providing best design practices so users will have fewer issues,” said Radhakrishnan.

SAN JOSE, CA — North America-based semiconductor equipment manufacturers reported bookings rose 10.7% sequentially in April, suggesting a near-term rebound is on the way.