2004 Magazine Archives

FEATURES

• Process Control
  Pb-Free Manufacturability and Test Control
  Lead-free solder is not a drop-in replacement electrically or mechanically. Determining the "sweet spot" between electrical contact and mechanical deformation.
  Terence Q. Collier

• Line Automation
  Can Odd-Form Automation Increase Returns?
  Still placing odd-form parts by hand? How to determine ROI of end-of-line automation.
  Allen W. Duck and Patty Chonis

• Cover Story
  Assessing Solder Joint Reliability in Pb-Free Assemblies
  A study finds distinctions between predictors of reliability for leaded and lead-free alloys.
  Steve Dowds

• Screen Printing
  Throughput vs. Cycle Time in Evaluating Paste Printing
  Is the best indicator of performance machine cycle time, or first-pass yield?
  Joe Belmonte and Bob Boyes

• Process Control
  Enabling Quick Response Manufacturing
  End manufacturing and supply-chain redundancies through software that enables flexible operations and fast changeovers.
  Doug Johnson and Vern Harrison

• Parts Management
  Programming for Mixed-Vendor Lines
  Creating part data libraries for placement machines is time-consuming, error-prone and labor intensive. New tools can automate the process.
  Bini Elhanan

PERSPECTIVES

• Caveat Lector
  Cracking the WIP.
  Mike Buetow

• On the Forefront
  A hard look at solid solder deposit.
  Phil Zarrow

• Talking Heads
  Siemens' Tilo Brandis.
  Mike Buetow

• EMS Insight
  A challenge to the new ODMs.
  Pamela Gordon

• ESD Basics
  A renewed need for ESD control.
  ESD Association

• Process Doctor
  Diagnosing residue problems.
  Terry Munson

DEPARTMENTS

Industry News
Market Watch
Ad Index
Assembly Insider
Product Spotlight

On the cover: Design and process factors are the focus of this month's cover story. (photo © David Freund)

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