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Home
2005 Articles
2005 Articles
2005 articles
Program for Calculation of Flip-Chip Standoff Height
Details
Written by
Joshua Ampofo, Richard LaBennett, Stephen Akwaboa and Dr. Frederick Ferguson
Published: 26 October 2005
Direct calculation is important, but tedious and time-consuming. Until now, that is.
Read more ...
Samsung Techwin's SM Series
Details
Written by
Staff
Published: 26 October 2005
In-transit component alignment, plus 3-sigma accuracy.
Read more ...
A Novel IR Rework System
Details
Written by
Mark Cannon
Published: 26 October 2005
Oynamic temperature control and sensors help manage heat in Pb-free processes.
Read more ...
Mixed Technology Gets Selective
Details
Written by
Scott Buttars
Published: 26 October 2005
Selective and fountain soldering can reduce skips and opens over traditional wave processes.
Read more ...
The Relationship of Components, Alloys and Fluxes, Part 2
Details
Written by
Dr. Ning-Cheng Lee
Published: 26 October 2005
Read more ...
Clean It Up!
Details
Written by
Terry Munson
Published: 26 October 2005
Incoming board and component cleanliness is crucial in building reliable product.
Read more ...
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Page 5 of 22
APRIL ISSUE
View the Digital
Edition Here!
Press Releases
BTU International to Discuss the Aurora Line of Solder Reflow Ovens at the SMTA Capital Expo
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing; Dr. Jian Li and Sarah Chen Comment
Semi-Kinetics Invests in Advanced Cleaning Technology with Aqua Klean T-15 Typhoon and AAT X Series Stencil Cleaner; Michael Wayne Leedom Comments
Surf-Tech Manufacturing Is Proudly Made in the USA, Delivering Quality Amid Tariff Changes; Stephen Eggart Comments
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