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2005 articles

A two-part look at bumping and encapsulation of flip-chip BGAs.

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How to adjust conveyors, pots, preheaters and solder modules for Pb-free processes.

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Technologies to slash manufacturing costs for the ubiquitous tags are being aggressively pursued.

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"No-flow" materials cut four steps, including one dispensing step and a reflow pass.

Soldering Tips Read more ...

Anyway you look at it, camera view plays a key role in defect detection.

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Talking Heads
Mark Cowell
Mark Cowell
 
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