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Home
2005 Articles
2005 Articles
2005 articles
Tin Whiskers and Conversion to Pb-Free
Details
Written by
American Competitiveness Institute
Published: 30 November 2005
A low-lead-content SnPb finish reduces whiskers while cutting lead volume by 85%.
Read more ...
Feeding Assembly Innovation
Details
Written by
Mike Buetow
Published: 30 November 2005
Hover-Davis’ John Hover
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Fluxing: The Critical Parameter in Wave Soldering
Details
Written by
Gerjan Diepstraten
Published: 29 November 2005
Read more ...
Surface Oxidation as a Tin Whisker Growth Mechanism
Details
Written by
W. John Wolfgong, Ph.D., Bob Ogden, Robert Champaign and Barbara Waller
Published: 29 November 2005
While water vapor accelerates whiskers, they also grow in ambient air.
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More Than an Association to Me
Details
Written by
Phil Zarrow
Published: 29 November 2005
A strong sense of community differentiates the SMTA from other professional organizations.
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A Game of Microns
Details
Written by
Mike Buetow
Published: 29 November 2005
Read more ...
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APRIL ISSUE
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Edition Here!
Press Releases
BTU International to Discuss the Aurora Line of Solder Reflow Ovens at the SMTA Capital Expo
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing; Dr. Jian Li and Sarah Chen Comment
Semi-Kinetics Invests in Advanced Cleaning Technology with Aqua Klean T-15 Typhoon and AAT X Series Stencil Cleaner; Michael Wayne Leedom Comments
Surf-Tech Manufacturing Is Proudly Made in the USA, Delivering Quality Amid Tariff Changes; Stephen Eggart Comments
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