FEATURES

• Cover Story
  Flextronics Gets Dialed In
  In an exclusive interview, the CTO of the world’s largest ODM/EMS divulges why is staking its future on TV tuners and lowering BoM costs.
  Mike Buetow

• Software Enhancements
  How Offline Programming Speeds NPI
  For top machine utilization, equipment needs to be in a production mode – building boards – not debugging programs.
  Sunil Chhabra and Mark Ogden

• Fluxing
  Spray Fluxing for Pb-Free Wave Soldering
  A three-part study of spray application and deposits for next-generation processes.
  Sanju Arora and Stanley Soderstrom

• Process Changes
  Practical Pb-Free Implementation
  Six major considerations covering equipment choice to process vailidation.
  Bruce Barton, Chrys Shea, Joe Belmonte and Ken Kirby

FIRST PERSON

• Caveat Lector
  Shipshape soldering.
  Mike Buetow

• Talking Heads
  Tyco’s George Szekely.
  Mike Buetow

MONEY MATTERS

• Focus on Business
  Managing program managers.
  Susan Mucha

• Global Sourcing
  Sourcing preowned equipment.
  Frank Clark

TECH TALK

• On the Forefront
  Where front- and back-end meet.
  E. Jan Vardaman

• Screen Printing
  Printing for pin-in-paste.
  Clive Ashmore

• Better Manufacturing
  But can you take it apart?
  Peter Grundy

• Soldering Tips
  Pb-free hand soldering.
  Lee Whiteman and Riley Northam

• Wave Soldering
  Taking a (second) pass.
  Gerjan Diepstraten

• Test and Inspection
  Testing the finishes.
  Stig Oresjo and Chris Jacobsen

• Countdown to Pb-Free
  Getting the lead out of standards.
  Tom Newton, David Bergman and Jack Crawford

• Process Doctor
  Goo, be gone!
  Terry Munson

• ESD Basics
  Hit the roadmap, Jack.
  ESD Association

• Equipment Advances
  Assembléon’s new placer.

• Technical Abstracts

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Ad Index
Assembly Insider
Mexitronica Product Preview
Classifieds

On the cover: How Flextronics leverages its lead in cellphone technology to expand into other hot new markets. (photo by Frank Bevans)

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