FEATURES

• Apex Recap
  Small Firms, Big Ideas
  Thanks in part to the RoHS conversion, companies are busier today than a year ago, but few are thinking about what to do once the Pb-free buzz ends. Plus: Excellence in service.
  Mike Buetow and Robin Norvell

• AXI Comparison
  AXI Test on Fine-Pitch Components Using Pb-Free and SnPb
  A powerful tool for process characterization during the transition to Pb-free solder, this study revealed less than 10% difference for Pb-free and SnPb TVs under different test coupons.
  Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Dason Cheung, Jeff Newbrough and Murad Kurwa

• Cover Story
  Running Pb-Free Reflow Profiles without Nitrogen
  TGA/DSC data show paste can be used in extended reflow profiles with reduced dT's even at fast printing speeds.
  Eli Westerlaken

• Reflow Soldering
  A Comparison of Convection and Condensation Pb-Free Reflow Soldering
  Convection runs at faster cycle times, while condensation is superior for heavier PCBs.
  Dr. Hans Bell

• Underfill Characterization
  A Fixture for Characterizing Underfill
  How a simple slab of aluminum and a slot to contain a little pane of tempered glass, ringed by adjustable clamps, can aid visibility.
  Tom Clifford

FIRST PERSON

• Caveat Lector
  Lucky number 8.
  Mike Buetow

• Letters

• Talking Heads
  Electronic Systems' Leo Reynolds.
  Mike Buetow

MONEY MATTERS

• Focus on Business
  What makes a good program manager?
  Susan Mucha

TECH TALK

• On the Forefront
  Maxed out.
  E. Jan Vardaman

• Screen Printing
  'Tidying up' the process.
  Clive Ashmore

• Better Manufacturing
  X-ray goes under the microscope.
  Peter Grundy

• Soldering Tips
  BGA repair for mixed assemblies.
  American Competitiveness Institute

• Wave Soldering
  Avoiding solder spikes.
  Gerjan Diepstraten

• Countdown to Pb-Free
  RoHS and China.
  Richard (Tad) Ferris and Hongjun Zhang, Ph.D.

• Equipment Advances
  Europlacer's component positioning system.

• Technical Abstracts

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Ad Index
Nepcon East Product Preview
Classifieds

On the cover: Solder bumps are shown during reflow in air. (Courtesy Cobar Europe BV)

• Prev
• Next