Test and Inspection
Evaluating ROI of AXI vs. AOI
A model for calculating savings from reduced DPMO against equipment investment costs clearly demonstrates that the economic benefits of either technology depend upon the board complexity, throughput, labor costs, cost of field failures and returns, and equipment performance, as well as capital equipment, programming and operating costs.
Keith Fairchild
Supplier Sourcing
Prototype vs. Production Outsourcing
When outsourcing PCBs, OEM procurement staff must fully understand the differences and nuances associated with prototype and production manufacturing, regardless of where those services are situated.
Zulki Khan
Board Finishes
Pb-Free Hot Air Leveled Solder Coatings
A series of tests from wetting balance to copper dissolution show that the most popular Pb-free pastes work better with HAL versus other common finishes.
Howard Stevens and Nimal Liyanage, Ph.D.
Cover Story
Simulating Pb-Free Reflow
Computational fluid dynamics simulation of the reflow oven makes it possible to design PCBs for Pb-free manufacturing by predicting thermal gradients during solder reflow processing.
Sherman Ikemoto and Robin Bornoff
The Dover Deals
'Confusion and Clarity'
As a new owner – Francisco Partners – enters the scene, what's in store for Universal, Vitronics and Unovis?
Mike Buetow
Caveat Lector
The downside of higher stocks.
Mike Buetow
Talking Heads
TXP's Eric Miscoll.
Mike Buetow
Focus on Business
Preventative maintenance.
Dr. Jonathan Linton
Screen Printing
Printer customization considerations.
Joe Belmonte
Better Manufacturing
When Lean goes too far.
Phil Zarrow
Soldering Tips
To flip, or not to flip?
American Competitiveness Institute
Wave Soldering
Configurations for soldering conveyor angles.
Gert Schouten
Equipment Advances
Assembléon's "A" series of placement machines.
Technical Abstracts
Industry News
Market Watch
Assembly Insider
Ad Index
Product Spotlight
On the cover: Predicting thermal gradients during reflow. (Photo courtesy Flomerics)