FEATURES

• iNEMI 2007 Roadmap
  Organic and Printed Electronics: The Next Big Thing?
  A wave of new functional electronic inks and printing platforms are poised to cut costs and speed throughput. Are these materials and methodologies ready for prime time?
  Daniel Gamota and Jie Zhang

• Cover Story
  Microvia-in-Pad: Possible Outcomes and Solutions
  The smaller and lighter, the better, right? But one solution for electronics anorexia – microvias-in-pad – is prone to voiding and should be integrated cautiously. This study found via filling a cost-effective solution.
  Chrys Shea
  

• Outsourcing PCB Design
  The PCB Design Outsource Proposition
  OEMs are looking outside for design partners. What options do designers have for surviving in an outsourced world?
  Joseph Zaccari

• SnBi Solders
  A Novel Low Melting Point Pb-Free Solder
  A SnBiX solder showed a melting point of about 186°C and cut the material cost; mechanical tests suggest its drop-in replacement potential.
  Yuanshan Li, Xiaojuan Lei and Zhenhua Chen

• Solder Joint Reliability
  Factors Affecting Voiding in Pb-free Solder Joints
  A study of solder materials and PCB finishes finds copper and certain flux formulations to blame for high voiding levels.
  Dr. G.J. Jackson and Dr. H.A.H. Steen

• Failure Mechanisms
  A Mixed Technology Reliability Assessment
  In an investigation of potential Pb-free component reliability problems, a major medical OEM learns some surprises about the failure mechanisms of SAC and SnPb eutectic solders.
  Dr. Lucian Kasprzak, Milind Sawant, Gerry Adams, Brian Lewis, Paul N. Houston, Dr. Daniel Baldwin and Mike Nahorniak

• Hand Soldering
  Extending Tip Life in Pb-Free Hand Soldering
  Pb-free solder joints form at higher temperatures than do SnPb joints, but hand iron temperatures need not be raised. Improved heater control techniques can eliminate temperature overshoot, improve thermal transfer and reduce idle temperature.
  Ed Zamborsky

• Optimizing Paste Deposits
  Mathematical Modeling of Solder Paste Stenciling for Process Control
  A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI verified a mathematical model for predicting volume and standard deviation of printed paste volume for all package styles.
  Tim Wright

• Pb-Free DfM
  Pb-Free Wave Solder Design Guidelines
  Because basic wetting and flow behaviors of alloys used in the process are changing, guidelines for everything from pad design to lead length should be reviewed.
  Dale Lee and Denis Jean

• Harsh Environment Reliability
  Conformal Coating and Board Cleanliness
  A rundown of the major coating types and application methods.
  Bryan Gillespie and Matt DeBenedetto

FIRST PERSON

• Caveat Lector
  The hardest sell.
  Mike Buetow

• Talking Heads
  CTS’s Ron Bell.
  Mike Buetow

• My View
  Who’s your customer?
  Lee Whiteman

MONEY MATTERS

• Focus on Business
  Process mapping lessons.
  Dr. Jonathan Linton

TECH TALK

• Better Manufacturing
  Not all XRFs are created equal.
  Phil Zarrow

• Screen Printing
  Different cultures, same problems.
  Joe Belmonte

• Tech Tips
  Underfill and BGAs.
  American Competitiveness Institute

• Wave Soldering
  Spouting off on blowholes.
  Gert Schouten

• Pb-Free Lessons Learned
  Truths about Pb-free wave soldering.
  Chrys Shea

• RoHS Revisited
  Those who forget the (near) past ...
  John Burke

• Process Doctor
  Eliminating dendritic growth.
  Terry Munson

• Equipment Advances
  Vitronics’ XPM3 reflow oven.

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Apex Product Preview
Ad Index

On the cover: Limiting microvias’ contribution to void formation. (Photos courtesy Cookson Electronics)

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