High Thermal Mass, Very High Lead Count SMT Connector Rework Process
Rigorous testing found local vapor phase clearly superior to alternative processes.
by Jim Bielick, Brian Chapman, Mitchell Ferrill, Michael Fisher, Phil Isaacs, Eddie Kobeda and Theron Lewis
New Year, New Outlook
An uptick in attendance on the floor overshadowed a lack of innovations in the booths.
By Mike Buetow and Chelsey Drysdale
EMS hot for LED.
Mike Buetow
FHP Reps’ Keith Favre.
Mike Buetow
Sayonara, electronics engineering?
Pete Waddell
Printed electronics: process revolution?
Randall Sherman
Bad grades.
Peter Bigelow
Inside the iPad.
E. Jan Vardaman
Post-print inspection.
Dr. Rita Mohanty
Hot solder dip: back in vogue.
Al Cable
Implementing a reflow process.
ACI Technologies Inc.
Solder flooding.
Paul Lotosky
Toward grid parity.
Darren Brown