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Underfilms
Assembly and Reliability of Preform Underfilmed BGAs in Drop Test and Thermal Cycling
Pb-free solders generally are inferior to Pb-free solders in drop or shock testing. Preform underfilms can provide greater BGA to PCB mechanical robustness in a fairly seamless way – attached on reels similar to passives and reflowed simultaneously with the components, with only a minor design change required. And the results are impressive.
by Andrew Mawer, Thomas Koschmieder, Paul Galles, Randy Anding, George Skevofilax and Tim Lippe

FIRST PERSON

• Caveat Lector
  Remembering our heroes.
  Mike Buetow

MONEY MATTERS

• ROI
  Ideas and enablers.
  Peter Bigelow

• Focus on Business
  Program management strategies.
  Susan Mucha

TECH TALK

• Designer’s Notebook
  Polarity markings.
  Duane Benson

• Screen Printing
  ”Good“ cavities.
  Clive Ashmore

• Selective Soldering
  Concurrent selective soldering.
  Alan Cable

• Test and Inspection
  Overlapping test strategies.
  Andrew Tek
• Materials World
  Reworkable underfills.
  Jie Bai

• Technical Abstracts
  In Case You Missed It.

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