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FEATURES

Stencils
Analysis of Stencil Tensioning (Elasticity)
Foil tension variations may create distortion and unpredictable print deposition. An explanation of methods for measuring the tension-elasticity across the foil, and how a novel technology can perform fast, real-time mapping of stencil characteristics.
by Ricky Bennett, Ph.D., and Richard Lieske

Reliability
The Role of Failure-Oriented-Accelerated-Testing for Field Functional IC Packages
Devices are known to pass qualification testing, then fail in the field. Does that suggest the test specifications are inadequate?
by Ephraim Suhir, Ph.D.

Defects Database
Trim Those Whiskers
The speed of dendrite formation depends on the material, voltage applied and separation distance between terminations. This is the case in a normal failure but is also exaggerated by the level of surface moisture.
by Dr. Chris Hunt

FIRST PERSON

• Caveat Lector
  Open places.
  Mike Buetow

MONEY MATTERS

• ROI
  Talent over tools.
  Peter Bigelow

TECH TALK

• On the Forefront
  Next-gen packaging.
  E. Jan Vardaman

• Screen Printing
  No more metal blades?
  Michael L. Martel

• Selective Soldering
  Overlapping the Field.
  Chris Denney

• Tech Tips
  Role playing.
  Robert Dervaes

• Test & Inspection
  Role playing.
  Robert Boguski

• Getting Lean
  Adapting to load variances.
  Debra Stebelton and Greg Goetz

• Technical Abstracts
  In Case You Missed It.

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