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FEATURES

COMPONENTS
A Custom BGA for Particle Physics Experiments
Deep inside the CERN collider, detectors capture faint electrical signals the particles produce during their transit. How a novel high-yield and higher functioning BGA package was designed to replace a more expensive COB part in the sensors.
by Benjamin Buck

CFTI
Metals from Africa
One of the biggest names in electronics – Philips – is out to change the fate of the Congolese people. In the process, the MNC has teamed with a pair of behind-the-scenes suppliers and a Dutch prince to revamp the electronics supply chain and overcome the Dodd-Frank Act.
by Mike Buetow

COMPONENT PLACEMENT
Improving Placement Modularity through Shared Resources
By maximizing the flexibility of existing equipment, and sharing equipment resources, assemblers can eliminate duplication and speed component placement.
by Matt Wyglendowski

FIRST PERSON

• Caveat Lector
  Unintended consequences.
  Mike Buetow

MONEY MATTERS

• ROI
  On the benefits of planning.
  Peter Bigelow

• Focus on Business
  Similar in Singapore.
  Susan Mucha
  

TECH TALK

• Final Finishes
  Specs for QFNs.
  Lenora Toscano

• Screen Printing
  Stretched to the limit.
  Clive Ashmore

• Test and Inspection
  High rel testing.
  Swee Chyee Goh

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