News
LIANYUNGANG, CHINA – Henkel Huawei Electronics Co., a joint venture of Huawei Electronics and Henkel Corp., announced plans to unveil its state-of-the-art mold compound manufacturing facility in Lianyungang, China on Oct. 26.
The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually.
The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research.
The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.
The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually.
The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research.
The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.
NASHUA, NH – NSAI announced the launch of its RoHS Compliance Assurance System certificate program, developed for organizations to demonstrate compliance to the E.U. RoHS directive enforcement guidance.
Upon successful completion of the assessment process, clients are issued a Certificate of Compliance to use to market and promote their manufacturing process.
“The organization does not necessarily have to be ISO-certified to benefit from this certification program,” said vice president Chris Morrell.
For information, visit www.nsaiinc.com/services/RoHS/.
Upon successful completion of the assessment process, clients are issued a Certificate of Compliance to use to market and promote their manufacturing process.
“The organization does not necessarily have to be ISO-certified to benefit from this certification program,” said vice president Chris Morrell.
For information, visit www.nsaiinc.com/services/RoHS/.
ORLANDO – SMTA is seeking abstracts for the 2008 SMTAI technical conference. Short course descriptions are also being solicited.
The abstract deadline is Jan. 7. Papers will be accepted March 7, and manuscripts are due May 26.
SMTA International will take place at Disney’s Coronado Springs Resort and Convention Center in Orlando, Aug. 17-21.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature. Papers are being solicited in the following categories: emerging technologies, components, assembly, PCB technology, process control and business.
Please submit abstracts at www.smta.org/smtai/call_for_papers.cfm.
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