News
WASHINGTON -- The Electronic Industries Alliance's board of directors has approved a plan that would split the assets of the trade goup coalition across five distinct organizations.
Under the plan, EIA will distribute its assets equally among its four current member associations -- The Electronic Components, Assemblies & Materials Association (ECA); the Government Electronics and Information Technology Association (GEIA); the JEDEC Solid State Technology Association (JEDEC); and the Telecommunications Industry Association -- and the Consumer Electronics Association, a former member of EIA.
Under the plan, EIA will distribute its assets equally among its four current member associations -- The Electronic Components, Assemblies & Materials Association (ECA); the Government Electronics and Information Technology Association (GEIA); the JEDEC Solid State Technology Association (JEDEC); and the Telecommunications Industry Association -- and the Consumer Electronics Association, a former member of EIA.
SUNNYVALE, CA – A new “reverse order” interconnection method describes a way to produce a finished electronics assembly with neither solder nor a circuit board.
The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence. What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.
The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence. What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.
YANTAI, CHINA – Henkel is continuing to expand in the solder
sphere market, recently opening its second major production hub. The 4,100 sq. meter plant will manufacture solder spheres
and Type 1 through Type 7 solder powders for semiconductor packaging and
printed circuit board assembly.
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