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ATLANTA – There is still time to register for Streamlining PCB Documentation for Successful Manufacturing, a free one-hour Webinar.

Presented by DownStream Technologies and UP Media Group, Circuits Assembly’s parent company, the Webinar will take place June 20 at 2 pm EDT.

The online event will focus on how BluePrint-PCB can change the way you create PCB documentation by using intelligent design data to automate the PCB documentation process. The event will include a live software demonstration.

Learn more at:

http://www.pcbshows.com/webinars/events/streamlining_pcb_doc/.

http://w.on24.com/r.htm?e=46652&s=1&k=8D97BB400F5C532CF1EB1F7E73609EEC.

WASHINGTON, DC – The latest update to AeA’s Competitiveness Series emphasizes the need to pass the pending free trade agreements with Colombia, Panama, and Peru. In the report, AeA says Central and South America are leading destinations for U.S. high-tech goods.

Rob Mulligan, AeA’s senior vice president international, states, “In terms of high-tech goods, the United States held a $14 billion trade surplus with the region in 2006, nearly 25% larger than it was in 2000.”

Last year, the U.S. exported $17.1 billion of high-tech products to Central and South America; combined, this makes the region the fourth largest destination for U.S. tech exports, ahead of the individual countries of China and Japan. Between 2005 and 2006, U.S. high-tech exports to Central and South America rose by 20%, says AeA.

High-tech imports from Central and South America declined by $200 million between 2005 and 2006, from $3.3 billion to $3.1 billion, says the report.

SINGAPORE – Chartered Semiconductor Manufacturing is ramping production of Tezzaron Semiconductor’s ultra high-speed memory chips.

In addition, the two companies are working on the manufacture of Tezzaron’s 3-D devices, and hope to see them become the first 3-D ICs to be manufactured in volume.

With Tezzaron’s FaStack technology, device circuitry is divided into sections built onto separate wafers using standard processing. Chartered enables 3-D stacking of these wafers by building hundreds of thousands of Tezzaron’s embedded thru-silicon interconnections, called Super-Contacts, into the circuitry on each wafer. The wafers are then aligned with a precision of 0.5µm, bonded, thinned, and diced into individual devices. A FaStack chip functions as a single device.

Chartered and Tezzaron will enhance the 3-D IC designs and build them into wafers produced by Chartered. Tezzaron plans to offer many types of 3-D IC memories in two, three and five layers using NanoTSV technology.

Chartered is also manufacturing Tezzaron’s 3T-iRAM family of 2-D 72Mb memory devices.