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AUSTIN, TX – Flip chip and wafer-level package sales grow more than 24% compounded from 2005 to 2010, according to a new study from TechSearch International.
 
In the report, the research firm found that performance and form factor continue to drive flip chip. Flip chip interconnect is expanding into high performance logic to a variety of devices found in wireless products. An increasing number of suppliers of ASICs, field programmable gate arrays (FPGAs), DSPs, chipsets, graphics, and microprocessors are expanding their use of flip chip in package (FCIP).  Read more ...
EL SEGUNDO, CA - China's slowing electronics industry growth is leading to reduced demand for semiconductors, prompting iSuppli Corp. to trim its revenue forecast for chips sold in China in 2006.
 
iSuppli currently expects China's 2006 semiconductor revenue to rise between 11% and 15%, which translates to $41 billion and $43 billion for the year. That’s down from the firm’s projection of 18% one year ago. Read more ...
CAMBRIDGE, UK – Active RFID is said to be growing, with several applications already more than $100 million, and is responsible for more than 20% of all spent on RFID. Leading the way: The U.S. military.

New IDTechEx research indicates that the value of sales of active systems will rocket from $550 million in 2006 to $6.78 billion in 2016.
Read more ...

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