News
TORONTO -- Celestica Inc. named senior vice president of finance Paul Nicoletti its interim chief financial officer.
He supersedes Tony Puppi, who is retiring April.
A search is currently underway to select a permanent replacement.
Nicoletti has been with Celestica since the its spinoff from IBM. Prior to his current position, he was the vice president, global financial operations.
He supersedes Tony Puppi, who is retiring April.
A search is currently underway to select a permanent replacement.
Nicoletti has been with Celestica since the its spinoff from IBM. Prior to his current position, he was the vice president, global financial operations.
EL SEGUNDO, CA – PMP/MP3 shipments are expected to more than double between 2005 and 2011, according to iSuppli Corp. Global PMP/MP3 shipments will rise to 268.6 million units in 2011, a CAGR of 13% from 2005, the firm predicts. In 2007, player shipments are expected to rise to 216.9 million units, up 21.8% from 178.1 million in 2006. Global factory revenue will rise to $21.5 billion by 2011, a CAGR of 7.4% from $14 billion in 2005. Revenue this year will rise to $20.6 billion, up 14.4% from $18 billion last year. PMP shipments are expected to grow faster than those of music-only MP3 players during the coming years, with PMPs expected to account for more than 66% of PMP/MP3 unit shipments by 2011, up from a mere 4% in 2005, according to iSuppli. iSuppli forecasts the broadband music market will grow to $5 billion in revenue by 2010, up from $1.6 billion in 2006. Still, some challenges remain for PMPs/MP3 players, including longer replacement cycles because of removable memory and stronger competition from media-capable mobile phones.
CANOGA PARK, CA – IPC has published the Stencil and Misprinted Board Cleaning Handbook, IPC-7526. A copy is available as a free download at www.SmartSonic.com/article.html.
According to the text, the handbook “addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted circuit boards (PCBs) and application tools connected to the soldering paste application process. The purpose of the handbook is to provide a basic understanding of stencil/misprint cleaning processes.”
According to the text, the handbook “addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted circuit boards (PCBs) and application tools connected to the soldering paste application process. The purpose of the handbook is to provide a basic understanding of stencil/misprint cleaning processes.”
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