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FORT WASHINGTON, PA – Kulicke & Soffa will acquire Alphasem, supplier of die bonder equipment, from Dover Technologies for $30 million, subject to a working capital adjustment. The acquisition is expected to close around Nov. 3, K&S said today.
 
In a statement, vice president Christian Rheault, called the acquisition “a natural extension of K&S’s core equipment business into die bonding equipment. The die bonding process precedes the wire bonding step in semiconductor chip manufacturing, and normally utilizes adjacent floor space and a common engineering team. This supplier consolidation will enhance our ability to provide solutions to our customers across a greater span of the semiconductor assembly process.” 
 
The die bonder market was $520 million in 2005, according to VLSI Research.  Dover put Alphasem and several other business units on the block in July.

HIALEAH, FL -- Electronics contract manufacturer Simclar Inc. expects June quarter net income of $790,000 on sales of $30.5 million, compared to net income of $510,000 and sales of $21.8 million for the March quarter.

The company will restate its 2005 and March quarter 2006 financials due to accounting errors in the company's Mexico subsidiary during 2005. Read more ...
ARMONK, NY -- IBM Corp. last week issued layoff notices to about 400 employees of its hardware development division. The company downsized staff in Austin, TX; Burlington, VT; San Jose; Raleigh, NC; and Rochester, MN.

Employees have 30 days to secure another job within the company, according to a spokesman.  Read more ...

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