News
SAN JOSE – Stanford professor of engineering Roger Howe will keynote the 5th Annual MEMS Packaging symposium, the MicroElectronics Packaging and Test Engineering Council announced. On May 16, Howe will discuss recent developments in the field. Howe, who has decades of experience with MEMS, also chaired the MEMS Technical Committee of IEEE Electron Devices Society from 1998 – 2001. The conference takes place May 16-17 in San Jose. Other presentations include MEMS-based market evolution; emerging trends; packaging technologies, and consumer and industrial applications. Graduate students, professors and university researchers will also present their latest work on MEMS packaging and related topics. To register or learn more about the symposium, contact Bette Cooper, bcooper@meptec.org or visit www.meptec.org.
BANNOCKBURN, IL – IPC is accepting comments on IPC-9592, Performance Parameters for Power Conversion Devices. The document standardizes the performance parameters for power conversion devices, including the computer and telecommunications industries. The specification also sets the requirements for design, qualification and conformance testing, manufacturing quality processes, and regulatory requirements. Comments are due June 2. A copy of the document and the comment form are available at ipc.org/PCSMeeting. The nearly 100-page proposal was developed by the IPC Power Conversion Subcommittee, chaired by Dr. Scott Strand of IBM. The next committee meeting will take place June 26-27 in Schaumburg, IL.
BRADENTON, FL – Connector analyst Ron Bishop will keynote the IICIT Connector & Interconnection Technology Symposium in May. The keynote will be about The World Connector Industry with special focus on the outlook for 2007 and 2011. Bishop is president of Bishop & Associates Inc., a consulting firm, and a noted expert on the connector industry. The conference takes place May 8-9, in Dedham, MA. For more information and registration, visit http://www.iicit.org.
