News
SAN JOSE – SEMI (semi.org) has formed a working group of member company volunteers to provide expertise and guidance on intellectual property issues. Most of the activities are centered on education and government relations.
The group recently commissioned a best practices paper on IP protection. The paper,
The group recently commissioned a best practices paper on IP protection. The paper,
NISKAYUNA, NY -- Binghamton University’s Integrated Electronics Engineering center (IEEC) and General Electric’s Global Research Center (GRC) have established an annual research symposium on National Trends in Small Scale Systems and Microelectronics Packaging. This year’s symposium will take place at the GE GRC facility in Niskayuna, NY, on Oct. 23-24.
It will offer information about promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies including: Nano Materials for Electronics, Flexible Electronics, NEMS/MEMS Developments, Optoelectronics, Sensors, Thermal Management, Sensor Packaging Integration, EcoElectronics - Lead Free Developments, BioElectronics, and Green Materials.
Approximately 150 participants, including development engineers and technical managers from major electronics companies and researchers from universities and government laboratories, will attend. Keynote presentations will provide an overview of recent developments in several areas vital to small scale systems and microelectronics packaging.
For the full program, visit: wtsn.binghamton.edu/coned/EP06Main.htm
It will offer information about promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies including: Nano Materials for Electronics, Flexible Electronics, NEMS/MEMS Developments, Optoelectronics, Sensors, Thermal Management, Sensor Packaging Integration, EcoElectronics - Lead Free Developments, BioElectronics, and Green Materials.
Approximately 150 participants, including development engineers and technical managers from major electronics companies and researchers from universities and government laboratories, will attend. Keynote presentations will provide an overview of recent developments in several areas vital to small scale systems and microelectronics packaging.
For the full program, visit: wtsn.binghamton.edu/coned/EP06Main.htm
SINGAPORE — Marvell, a fables semiconductor company, broke ground this week on its new regional headquarters in Singapore. The 100,000 sq. m. facility will house regional headquarters and include integrated design (IC) assembly and test operations, IC design, sales and technical support functions. The RHQ is expected to be completed in mid-2008.
Marvell currently employs 200 people in Singapore and plans to increase the number of employees to more than 500 within the next five years focusing on IC design and test and assembly engineering staff.
The company has operations throughout Asia including Malaysia, China, Japan, Taiwan and India.
Today, Singapore hosts 20 chip assembly and test plants, 14 wafer fabs and 40 IC design companies.
Marvell currently employs 200 people in Singapore and plans to increase the number of employees to more than 500 within the next five years focusing on IC design and test and assembly engineering staff.
The company has operations throughout Asia including Malaysia, China, Japan, Taiwan and India.
Today, Singapore hosts 20 chip assembly and test plants, 14 wafer fabs and 40 IC design companies.
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