News
WASHINGTON -- With Congressional action
to mark up DTV legislation approaching rapidly, 31 CEOs and corporate
presidents of leading U.S. high-tech companies are calling on the House
and Senate Commerce Committees to enact a "hard date" now for the
successful conclusion of the transition from analog to digital
television.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
GLEN COVE, NY -- Photocircuits Corp., once the largest
independent manufacturer of
printed circuit boards in North America, has filed for Chapter 11
bankruptcy. The filing involves only the company’s U.S. operations
and does not affect its Costa Rica or Philippine operations.
The company is seeking a new long-term equity investor.
FRANKLIN, MA – Speedline Technologies has been granted a patent for an analysis technique
used to quantify the amount and geometry of solder paste between printed deposits.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
