News
DES PLAINES, IL — Kester will hike prices on many of its fluxes, thinners and other chemical products in response to rising costs for raw
materials used in chemical products.
The move is effective Oct. 15.
The move is effective Oct. 15.
New Tripoli, PA – High demand for digital consumer and mobile applications is driving demand for high-density packages, according a recent report by The Information Network. The group projects total HDP market growth of 32% in 2005, reaching 1.5 billion units.
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
FRANKLIN, MA –Speedline Technologies’ recent award of seven new U.S. patents lifts the company’s total above 400, 150 of which are active. The company has another 90 patents pending.
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
