News
Norcross, GA, March 23 -- The Electronics Assembly Systems Division of Siemens Logistics and Assembly Systems Inc. is providing SMT Process training on April 18-22, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at Rochester Institute of Technology, (RIT).
The training will take place at RIT's CEMA facility in New York. It features a fully equipped SMT Laboratory, which includes screen printing, dispensing, pick-and-place, reflow, rework stations, optoelectronics workstations, wire bonding, test and inspection equipment.
The hands-on course provides participants with a thorough understanding of SMT and advanced packaging principles needed for supporting and troubleshooting the SMT process. It will offer discussions on process parameters and process characteristics, paste qualification including lead-free solder compounds, as well as identifying and correcting defects.
The course is offered as a result of the Siemens Electronics Consortium for the Advancement of Electronics Manufacturing Education (CAEME).
Using a patented off-center tomosynthesis imaging technique, ClearVue is suited for densely packed single- or double-sided boards that use BGA-style components, or when loss of electrical or optical access is problematic.
Compared to laminography and other 3-D x-ray techniques, the technology reportedly provides superior image clarity, diagnostic capabilities and full board coverage to expose solder (including lead-free) flaws that are otherwise overlooked.
Operates using a stationary x-ray source and detector and, unlike conventional systems, does not require complex or rotating mechanical parts. Said to result in lower false call rates (promising up to 40 times improvement over existing solutions), improved reliability, better repeatability and improved cycle times.
FRANKLIN, MA- SMT knowledge experts from Speedline Technologies
will lead a free, one-hour Webcast seminar on April 14 to answer
questions engineers need to consider before implementing lead-free
reflow soldering processes on their manufacturing floor.
The Webcast, scheduled from 11 a.m. to Noon, EST, will feature live discussions of process challenges, new technologies, how-to implementation information and participant questions. Topics include:
Required equipment and process changes; Details to consider in optimizing the lead-free process; Reflow equipment configurations and differences; Producing lead-free assemblies; Nitrogen process variables; Cooling considerations; Cost of operation.
For more information, visit: speedlinetech.com/seminars.
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