News
TORONTO -- Celestica Inc. has acquired CoreSim, a Canadian-based provider of advanced design analysis and redesign services. CoreSim will strengthen Celestica's design services by adding intellectual property, including its engineering tools and processes for electronic design projects. CoreSim currently provides services to some of the world's leading OEMs.
CoreSim will offer its proprietary tool, Schematic Modeling, that identifies wiring and technology issues in schematics. It provides design analysis which independently verifies and validates pre-layout customer designs to assist in keeping engineering projects on-time and within budget.Bangalore, India — Two Indian PCB design companies have been acquired by overseas companies, in unrelated deals announced last week, strengthening the possibility that the country may become a major electronics manufacturing location.
According to a Reuters news, EMS provider Celestica acquired Ramnish Elecronics Pvt. Ltd. (Hyderabad, India), which provides design, PCB assembly and system assembly to Indian and overseas markets. Celestica plans to relocate Ramnish to expanded manufacturing facilities later this year. Financial terms were not disclosed.DES PLAINES, IL —Kester will host a course featuring RoHS/Lead-free training on August 23 and 24 at its Des Plaines facility.
The training gives updated information and practical experience to enable rapid, effective implementation of Pb-free assembly. Will include practical demonstrations of Pb-free assembly and rework process assembly.
On Aug.23, attendees will receive classroom instruction on lead-free alloy selection for SMT; flux-critical selection parameters; equipment requirements; component and board finishes; paste in-hole with lead-free; solderability and how to enhance it; troubleshooting the lead-free SMT process; and thermal profiling for lead-free assemblies. Lunch and a networking session will be provided. Classroom instruction will also focus on compatibility issues; BGA lead-free attach; pin testability and inspection; reliability of SMT joints; preventing and reducing defects; reworking lead-free solder joints; and thermo-gravimetric analysis (TGA) of fluxes and the impact on process.
The half-day session on Aug. 24 provides attendees with a hands-on application session for lead-free SMT process implementation. Attendees are encouraged to bring their boards/application for a lead-free solution .
Attendees will receive a Project 2005: Achieving Lead-Free RoHS Assembly Technical Manual and the Lead-Free Connection Newsletter.
For info. on technical content of the seminars, contact: Peter Biocca, Kester, 972-390-1197 or pbiocca@kester.com. For general info., contact Shirley Wood, Kester, 800-253-7837 or kesteruniversity@kester.com.
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