JERUSALEM – Shellcase Ltd., a provider of wafer-level electronic product miniaturization technologies, has developed a next-generation platform for optical devices, ShellUltraThin, that provides a true die-sized package.

Based on patented packaging technology, ShellUT provides x/y dimensions identical to the original chip and a reduced thickness. A glass-silicon structure, including a cavity between the image area and the glass, enables image-sensing capabilities through the packaging structure, allowing for the use of micro-lenses. Is available for captive and non-captive license for integration into existing processing lines.

Wafer-level packaging platforms enable economies of scale for manufacturers of semiconductor device, such as CMOS and CCD area array and linear sensors, other optical devices like photodiodes, as well as various types of RF-MEMS devices, memories and mixed signals.

The company estimates that its chip size packaging solutions are used in over 30% of the installed base of camera phone handsets worldwide.