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ROCHESTER, NY, Oct. 15 - EMA Design Automation has entered an agreement to exclusively distribute and support Chronology's TimingDesigner timing analysis tool in North America.

"Timing analysis plays an increasingly prominent role in the identification and resolution of system operation issues," said Manny Marcano, president and CEO of EMA, in a statement. "Through this collaboration, we can now offer our customers the ability to obtain fast and complete timing margin analysis for their designs."

Chronology is a division of Forte Design Systems.

TimingDesigner is an interactive timing analysis and diagram tool for defining timing constraints, evaluating timing parameters, creating specifications and analyzing complex interfaces.

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SCHÄRDING and RADFELD, Austria -- EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a flip-chip and die bonding equipment supplier, announced a development, sales and marketing agreement for advanced-chip-to-wafer (AC2W) technology.

AC2W technology offers high device density through stacked devices, short interconnects and higher functional density. It enables the integration of various device technologies such as hybrid integration of IC and MEMS functionality.

The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices under defined process conditions, after they have been fixed with a temporary fixing agent in a high-precision flip-chip bonder from Datacon. The technology used for the bonding process is called face-to-face solid liquid interdiffusion, a technology that uses a metal soldering process.

"Our equipment allows a pre-bonding performance of up to 8500 chips per hour together with placement accuracy of 10µm@3s", said Helmut Rutterschmidt, president of Datacon Technology AG. "[We] can handle top chips as thin as 50 µm and wafers up to 300 mm diameter."

Developed in a joint R&D project, the new equipment platform has been successfully installed at Infineon AG, a major semiconductor device manufacturer.

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HSIN CHU, TAIWAN, Oct. 15 -- Kulicke & Soffa Industries today opened a state-of-the-art probe card manufacturing facility here, a move designed to boost the company's presence in the vertical probe card market.  

The plant has 2,400 sq. meters of floor space and will build enhanced cantilever probe cards. It can also handle probe wire diameters from 75 to 250 microns and very fine pitch probing.

The factory will follow K&S' "copy exact" manufacturing model.

Production on after-sales support center for repair and rebuild services in its final stages, the company said.

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