News
Cleveland, OH, Oct. 13- Linda Rae, senior VP and general manager of Keithley Instruments Inc., will keynote the 2nd annual EOEM Design Online Expo this afternoon. Her presentation, "Best in Test: How World Class Organizations Rely on Testing To Make Better Products," will take place Oct. 13 from 2:30 to 3:00 p.m. in the Test & Measurement Technology Pavilion.
The presentation will discuss the test philosophies at some of the most successful electronics manufacturers, as well as test strategies to improve manufacturing processes and overall product quality.
The EOEM Design Online Expo is an online conference and exhibition addressing critical technology areas impacting electronic design engineering. Running Oct. 13-14, it covers embedded technology, integrated circuits, packaging & interconnects, passive components, power, and test & measurement. For more information and to register online, visit www.reedbusinessinteractive.com/eoem/index.html.
TAIPEI, Oct. 11 -- Chip-on-board packages could get caught in an upward draft as image sensor modules in camera phones are switched from CSPs.
As much as 50% of camera phone models will be 1.3-megapixel type in 2005, DigiTimes reported today, citing market sources. The models will use COB packaging for CMOS-sensor modules, the Asian-based news service said.
Micron Technology and IC Media began offering COB CMOS sensors earlier this yer, DigiTimes said.
Des Plaines, IL, Oct. 11 — The next Lead-Free Technology Seminar presented by Kester, Metcal, BTU International and Soldering Technology Inc. (STI) will take place Nov. 9-10, 2004, in Atlanta, GA .
Designed to assist electronics assembly manufacturers with the implementation of lead-free assembly operations, the seminar covers Pb-free soldering in SMT, wave soldering, BGA profiling and rework. Successful case studies will also be discussed.
The seminar will help attendees develop a solid understanding of the process variables to maintain production yields and product reliability with Pb-free operations. Additional topics will include alloy selection, flux selection, wave process, SMT assembly, inspection and documentation, rework and hand soldering, reflow optimization and lead-free reliability.
Presenters include:
· Peter Biocca, senior market development engineer, Kester
· Paul Wood, market development manager, Metcal
·Fred Dimock, senior process engineer, BTU International
· Jason Gjesvold, analytical lab manager, STI.
To register, visit www.metcal.com.
For additional details, contact Theresa Rudnick, Kester, at (847) 699-5580 or trudnick@kester.com.
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