News
SINGAPORE, Oct. 14 -- Flextronics said today its takeover of a pair of Nortel Networks' manufacturing plants would be delayed.
The two Canadian facilities are expected to be transfered in February and May 2005, respectively. Previously, Flextronics was to take charge of the plants in November 2004 and February 2005.
The deal is expected to add $2.5 billion of revenues for Flextronics.
In a statement Flextronics' officials said the deal would go through as otherwise planned.
Research Triangle Park, NC, Oct. 13 -- MCNC Research & Development Institute (MCNC-RDI), a North Carolina-based nonprofit research organization, and the North Carolina Agricultural and Technical State University (N.C. A&T) will partner to conduct research related to technological advancements in flexible displays for U.S. Army mobile electronics applications.
The $1.5 million award, spanning three years, establishes the Center of Excellence for Battlefield Capability Enhancements to develop technologies for environmentally stable flexible displays.
N.C. A&T and MCNC-RDI propose to develop a hybrid light-emitting device (HLED) for mobile electronics and vehicle-based communications and weapons systems required by Future Force Warrior (FFW), the U.S. Army's initiative to develop and demonstrate revolutionary support systems for soldiers.
To develop the HLED technology, MCNC-RDI will combine its OLED experience with N.C. A&T's expertise with narrow bandgap semiconductors composed of inorganic materials. MCNC-RDI and N.C. A&T research facilities will be used throughout the project.
Franklin, MA, Oct. 12- Speedline Technologies' series of free monthly technical Webcast seminars exploring the challenges facing engineers in the semiconductor manufacturing
Process will continue this fall. Each seminar, hosted by industry experts, will share "knowledge in process" expertise, how-to insights, and include a Q&A session.
The next session, "Improving Final Product Quality," will take place Oct. 21 at 11 a.m. ET and again at 2 p.m. ET.
The seminar will cover:
o Cost and types of a defect.
o Impact of printing defects on first pass yield.
o Preventing defects.
o Inspection and test process planning.
o 2-D and 3-D solder paste inspection.
Future session includes "Reliable Underfill Dispensing," on Nov. 18 at 11 a.m. and 2 p.m. ET, and "Fine Pitch Printing Process," scheduled for Dec. 16 at 11 a.m. and 2 p.m. ET.
For more information, or to register, visit www.speedlinetech.com/seminars, or call (508) 541-4749.
