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ARLINGTON, VA, Aug. 9 - July bookings of electronics components slowed for the first time in nearly a year but are expected to pick up in the fall, said a trade group that tracks monthly orders. 

Orders flattened in July, their first slowdown in 11 months, reported the Electronic Components, Assemblies & Materials Association, a trade group of component makers and assemblers.

"After almost a year of steady upward movement, the market seems to have taken a bit of a breather in July," said Bob Willis, ECA president, in a press statement. "We suspect that this will be temporary and that growth will resume by the end of this quarter through the close of the year."

Executives from manufacturers who met at ECA's spring conference said they expect growth well into 2005, ECA said.

The ECA is a sector of the Electronic Industries Alliance.

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TAMPA, Aug. 4 -- Reptron Electronics reported second-quarter sales of $35.6 million, down about 10% from last year.

For the quarter ended June 30, Reptron recorded a pro-forma loss from continuing operations of $174,000, excluding reorganization expenses. This compares to a $711,000 loss a year ago. The net loss was $147,000, vs. $2 million last year.

Gross margins improved sequentially.

In February, Reptron emerged from Chapter 11 bankruptcy, having sold various assets of its components distribution and memory module divisions.

"Reptron Electronics continued on its road to recovery during the second quarter," said Paul Plante, president and CEO. "We continue to see signs of an improving economy through increasing customer demand."

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TAMPA, FL, Aug. 9 -- Reptron Electronics has signed a multimillion dollar contract to build electronics assemblies for Clear-Com Communication Systems.

"This is an important business development for Reptron that increases our capacity to provide manufacturing services for the communications industry sector," said Bonnie Fena, president of Reptron Manufacturing Services.

Full production is expected to ramp by the end of 2004.

Under the deal, Reptron will build 150 different subassemblies and PCBs for wired and wireless intercommunications products. Much of the current phase involves converting from plated through-hole to to surface mount technology.

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