News
Minneapolis, MN -- Dr. Bruce McWilliams, chairman and CEO of Tessera Technologies, will present the keynote speech at the International Wafer-Level Packaging Conference, Nov. 3-4, at the San Jose DoubleTree Hotel, CA. The keynote, "Why Wafer-Level? Its Promise and its Future", will be given at a special dinner on November 3.
He will explore the universe of semiconductors and semiconductor packaging technologies and look at the promise offered by wafer-level packaging, including "killer" applications that will propel growth and the technical hurdles that must be overcome.
Dr. McWilliams joined Tessera in 1999 as president and CEO. He became chairman in February 2002. He had previously served as president and CEO of S-Vision Inc., a silicon-chip-based display company that he co-founded. He was also a senior vice president at Flextronics International Ltd.
The event features an exhibition of suppliers to the semiconductor packaging and testing industry, and the technical program explores semiconductor packaging, including chip scale packaging, 3-D packaging, system-in-package, system-on-chip, system-on-package and wafer-level packaging.
For more info: smta.org/iwlpc/
SAN JOSE - Worldwide semiconductor manufacturing equipment billings reached $9.4 billion in the first quarter, according to the industry trade group SEMI, up 2.3% from a year ago and 6.5% sequentially. Bookings ($7.25 billion) were down 21% from a year ago and 12% from the fourth quarter.
The data, collected in concert with the Semiconductor Equipment Association of Japan, come from more than 150 equipment companies.
"The
first quarter billings showed some positive momentum over the fourth
quarter of last year, while worldwide bookings for semiconductor
manufacturing equipment are down for the same period," said Stanley T.
Myers, president and CEO of SEMI.
Billings in Korea were up
significantly sequentially, Myers said.
HERNDON, VA - The International Electronics Manufacturing Initiative (iNEMI) is sponsoring a workshop on tin whiskers as part of IEEE's Electronic Components and Technology Conference on May 31-June 3, in Lake Buena Vista, FL. iNEMI will present the results of its third set of whisker experiments, , which provide additional insight into tin whisker formation and growth.
Presentations will also cover the latest theories regarding the cause and effect of stress formation in tin film, the mechanism by which material moves through the structure, and the causes of whisker growth. In addition, a recently discovered factor in tin whisker generation will be discussed - heavy oxidation or "corrosion" of the tin in humid environments. Data on testing and the impact of oxidation on whisker growth will be covered.
Dr. Henning Leidecker, NASA, will serve as moderator for the workshop. The event is chaired by Ron Gedney, iNEMI consultant, and Maureen Williams, NIST. For a complete agenda:
http://www.inemi.org/cms/calendar/tin_whisker_workshop.html.
In addition to the iNEMI workshop, the ECTC technical program includes a session on solder and tin whiskers (Session #10, Materials & Processing Committee) on June 1.
Online registration is available at
https://www.ec-central.org/conference/ectc/55/doorregistrationform.cfm.
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