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TOKYO – Toppan Printing has developed a flexible thin-film transistor that reportedly withstands a million bending cycles to a 1mm radius of curvature and demonstrates advantages for practical application, such as an on/off current ratio of at least 107 with carrier mobility of 10cm2/Vs or more.

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IRVINE, CA – TopLine has been granted a US patent for lead-free solder columns for column grid array substrates.

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TAIPEI – Pegatron expects to complete expansions in Vietnam and India in the second half of 2021 and begin an expansion at a North American plant this year, say reports.

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