PHNOM PENH, CAMBODIA -- Cambodia has greenlit a pair of investments totaling nearly $5 million combined in new electronics assembly plants, according to the Council for the Development of Cambodia (CDC).
AUSTIN, TX -- Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply.
MILPITAS, CA — The global semiconductor materials market grew 4.9% in 2020 to $55.3 billion in revenue, surpassing the previous market high of $52.9 billion set in 2018, SEMI reported today.