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BANNOCKBURN, IL — North American printed circuit board shipments rose 9.1% year-over-year in May, IPC announced today.
AUSTIN, TX -- TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch.
NEW DELHI, INDIA -- The US isn't the only nation placing intense emphasis on its boosting domestic semiconductor industry.
