IRVINE, CA – TopLine has been granted a US patent for lead-free solder columns for column grid array substrates.

TopLine holds seven patents in the field of CCGA.

TopLine has employed engineering resources in recent years to develop novel approaches to manufacturability and reliability of CCGA components that are usable with field programmable gate arrays and application-specific integrated circuit packages. CCGA packages are assembled with solder column terminations that reduce stress in harsh environments, stresses resulting from wide temperature swings when mounting materials having different coefficients of thermal expansion onto printed circuit boards.

“Our unique lead-free solder column is designed with an inner copper core that prevents collapse of the semiconductor chip that also serves as a heat-sink to conduct heat from the underside of the CCGA package, resulting in enhanced reliability,” said CEO Martin Hart. “The novel Pb-Free column structure conforms to RoHS directives that assure restriction of hazardous substances in electrical and electronic equipment. We’re pleased to have been awarded this patent.”

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021!

• Prev
• Next