News
SAN JOSE, CA – Flex reported fiscal fourth quarter net sales of $6.4 billion, up 9% year-over-year.
LYON, FRANCE – The panel level packing (PLP) market is expected to reach $285 million in 2023, a 51% CAGR during the 2017-2023 period, according to Yole Développement.
MILPITAS, CA — North America-based manufacturers of semiconductor equipment posted $2.42 billion in billings worldwide in March on a three-month average basis, says SEMI.
Press Releases
- Industry Leaders Koh Young, Fuji America, and Creative Electron Unite to Launch The SMT Future Experience
- NanoFlowX Announces Strategic Partnership with Bentec Ltd to Accelerate PCB Protection Innovation Across Europe and India
- Strong signal for the industry: productronica 2025 drives positive industry trend
- Sharpen Your ESD Skills: CE3S Announces Desco’s First ANSI/ESD S20.20 Training Series for 2026