News
MINNEAPOLIS – The Best of Conference and winner of the 3D track for the International Wafer-Level Packing Conference was Jessica Fredlund, Silex Microsystems. Coauthors of her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors,” include Toby Ebefors, Silex Microsystems, and Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.
TAIPEI -- An investigation into alleged bribe-taking at Foxconn is underway, and the EMS giant says it will cooperate in full. Authorities are looking into the dealings of at least 10 company executives following reports last year that workers in its SMT group had been taking bribes from suppliers.
DUBLIN -- A new study of PCB, material and interconnect trends and needs for electronics assemblies for high-speed applications explores the implications for next-generation architectures and the supply chain as data rates increase.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing