News
FRAMINGHAM, MA – Worldwide PC shipments will decline 1.3% this year on sluggish desktop PC sales, according to research firm IDC.
AUSTIN – Flip chip in package is expanding in mobile computing, especially smartphones and tablets. In units, the compound annual growth rate from 2011 to 2016 is almost 26%, says TechSearch International.
BANNOCKBURN, IL – January North American printed circuit board shipments were down 1.1% year-over-year, and orders decreased 4% compared to January 2012, says IPC.
Press Releases
- AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
- Indium Corporation to Showcase Durafuse Solder Technology at Productronica India
- Universal Instruments Joins Parent Company Delta to Highlight Comprehensive Semiconductor Solutions at SEMICON Taiwan
- Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024