MILPITAS, CA — SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) won a $300,000 grant from the US Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US.
VEJLE, DENMARK – Electronics manufacturer GPV reported record first quarter revenue of more than DKK 1 billion (US$143 million), up 36.2% year-over-year.
TVER, RUSSIA – Jabil shut down operations at its site here, notifying some 90 Russian staff, according to reports.