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MILPITAS, CA — SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) won a $300,000 grant from the US Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US.

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VEJLE, DENMARK – Electronics manufacturer GPV reported record first quarter revenue of more than DKK 1 billion (US$143 million), up 36.2% year-over-year.

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TVER, RUSSIA – Jabil shut down operations at its site here, notifying some 90 Russian staff, according to reports.

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