News
BANNOCKBURN, IL – The establishment of a pilot facility in the US for manufacturing IC substrates is a first step towards re-establishing semiconductor packaging within the United States, and the CHIPS and Science Act of 2022 can be used to jump start the effort, according to a white paper released by the IPC's Chief Technologist Council.
MOUNT PLEASANT, WI – Microsoft plans to build a $1 billion data center on a 315- acre plot of land currently owned by Foxconn in Mount Pleasant, WI.
SAN FRANCISCO – Tempo Automation announced that it has entered into a definitive agreement to acquire Optimum Design Associates, an electronic design services company with offices in the United States and Australia.
Press Releases
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments
- Medco West Enhances PCB Cleaning Capabilities with Installation of Typhoon T9 Aqueous Inline Cleaner; Peter Sowinski Comments
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities