Products
Yincae's Diamond Underfill UF 158D is engineered to deliver exceptional thermal management in advanced semiconductor applications, achieving 8 W/m·K thermal conductivity through nano-engineered diamond particles. Designed for flip-chip, 2.5D/3D integration and high-density interconnects, UF 158D reduces solder fatigue, mitigates CTE mismatch and enhances long-term device reliability. Its strong adhesion and mechanical robustness make it well-suited for next-generation packaging demands. Available in both dispensable and jettable formulations, UF 158D has passed JEDEC reliability standards.
Metcal PT4-4000 and PT4-8000 Series 4-Zone Circuit Board Preheaters deliver thermal control for advanced electronics manufacturing and rework applications. Using Resistive Radiant Heat Technology, the systems radiate heat from a ceramic plate through a tempered glass surface, eliminating hot spots and ensuring consistent temperature distribution across the board. Each unit features four independently controlled temperature zones to accommodate a wide range of PCB sizes and thermal profiles, with real-time feedback from external thermocouples that continuously monitor and adjust heat output for maximum accuracy.
Advanced temperature control modes and programmable thermal profiles enable repeatable, application-specific performance, while enhanced flexibility makes the preheaters ideal for high-density assemblies, multilayer boards, and thermally demanding components. Designed to support both production and repair workflows, the PT4 Series integrates seamlessly into processes ranging from consumer electronics and data center hardware to aerospace, defense, and medical devices. The series is compatible with Metcal’s premium circuit board holders, which provide stable, adjustable support during heating and rework operations.
Mectal
Master Bond's LED422DC90 is a nanosilica-filled, one-component dual cure adhesive designed for high-speed fixturing and bonding of opaque substrates. The system’s side-bonding capability allows rapid polymerization up to 3–4 mm deep using angled 405 nm LED light, with final curing achieved through a secondary heat process at 90–95°C for 30–45 minutes. Combines dimensional stability with low thermal expansion (30–40 x 10⁻⁶ in/in/°C), and delivers strong mechanical properties, including tensile strength of 6,000–7,000 psi and lap shear strength of 800–900 psi (aluminum-to-aluminum). The adhesive is optically clear with a refractive index of 1.49, Shore D hardness of 85–90, and elongation of 1–3%. Functions as a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm and meets NASA low-outgassing requirements.
Press Releases
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