SMT 2017 (20.20) inline board cleaner uses patented rollers and a new proprietary adhesive to increase conductivity of the product without adding conductive particles.
R360 forced convection reflow soldering oven features a new airflow concept said to reduce energy consumption, whereby air moves from the fan to the PCB, then through a baffle plate, filter and heat exchanger.
Solder Fortification preforms are generally rectangle- or disk-shaped pieces of alloyed metal that do not contain any flux.