Products
PF606-XP LED dipping solder paste has great viscosity characteristics and stable tackiness, exhibiting uniform dipping volume and transfer rate.
Shenmao America, www.shenmao.com
PF606-P128 lead-free LED die bonding solder is available for dispensing in syringes in lower viscosity; exhibits excellent slump characteristics, consistent dispense ability, and stable tackiness.
Shenmao America, www.shenmao.com
PF606-P116 lead-free LED die bonding solder reportedly offers long stencil printing life, high tackiness (slump resistance), and consistent printability with excellent wetting characteristics for LED die bonding.
Shenmao America, www.shenmao.com
Press Releases
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