Products
Femto 2 die bonder, for advanced packaging and bonding, has a placement accuracy of ± 0.5µm @ 3 Sigma.
SA series automation feeders use SSF feeder technology to enable a range of interface and control capabilities, including ASCII communication protocol, lower profile form factor and optional SAFP robotic interface module for drop-in integration. Reportedly enable more integration flexibility and control options, particularly when smaller form factor or higher level of performance is required.
Hover-Davis, www.hoverdavis.com
Uflex modular automation platform facilitates user-level programming by leveraging a cloud-based library of predefined process strategies. Is built on high-performance base with 2G acceleration, 50μm accuracy and 8μm repeatability. Supports boards up to 630 x 500mm, components up to 38 x 127 x 50mm, and processes including pick-and-place, dispensing, screw driving, labeling, and test handling. Can be integrated into Lean assembly lines or configured inline.
Universal Instruments, uic.com
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