Products
BP 256 solder joint encapsulant is for BGA, CSP, flip-chip, PoP, and other ball bumping applications. Is said to create a solder joint bond five to 10 times stronger than a conventional solder joint, enhancing reliability and eliminating cracking. For use in lead-free, SnPb and SnBi processes. Reworkable.
Yincae, http://www.yincae.com/technical-information.html
iFlex T2 surface mount machine can place component heights up to 21mm. Includes tray and tube feeding capability. Is designed for high mix environments. Reportedly achieves first-pass yield production levels with defect levels of less than 1dpm.
Assembléon, www.assembleon.com
Quad 01005 ceramic nozzles enable placement for 0201 and 01005 micro-components. Measure 0.32mm OD with a 1mm ID.
Count On Tools, www.cotinc.com
Press Releases
- Adam Ryder appointed as Managing Director of Incap UK
- Metal Etch Services Opens New Motor City Facility to Meet Growing Midwest Demand
- Yamaha surface-mount line powers the future of specialized production at Inter-Company in Netherlands
- Matric Group Becomes the First U.S. Manufacturer to Deploy Panasonic NPM-GH Dual Lane SMT Technology