Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.
AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.
Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.