Products
The Handbook of Electronic Assembly and A Guide to SMTA Certification, authored by Ronald Lasky, Ph.D., James Hall, Katherine Hickey and Jennifer Tate, Ph.D. is a reference manual for process engineers in electronics and those new to the industry. Provides in-depth view of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test. Originally conceived as a supplement to the SMTA Certification Program. 81 pages.
SMTA, www.smta.org
ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be soldered.
Yincae Advanced Materials, www.yincae.com
LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.
Yincae Advanced Materials, www.yincae.com
Press Releases
- New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing
- Semi-Kinetics Brings on Colin Forgy to Lead Manufacturing at Idaho Facility
- Absolute EMS Expands Advanced Assembly Capabilities with SASinno Americas PF-6T High-Precision Connector Press-Fit System
- VJ Electronix Partners with The Murray Percival Company to Expand Support Across the Midwest