Yincae Debuts LEN66AL Die Attachment Adhesive
Published: 11 April 2014
LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.
Yincae Advanced Materials, www.yincae.com
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